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The Development Trend of BGA Assembly Technology

With the rapid development of LSI technology, the through-hole technology (THT) that flourished in the 1960s has gradually been replaced by the first generation of surface mount technology (SMT), which emerged in the 1980s. By the late 1970s, peripheral packaging had become the mainstream of electronic packaging, and QFP packaging had been widely adopted. In the 1990s, QFP packaging witnessed a fine pitch and leading board assembly technology; however, many technical issues remained unsolved in the assembly of board-level circuits with less than 0.4mm pitch. Thus, the second generation of SMT, ball grid array packaging (BGA), was launched in the early 1990s and became the preferred solution. Particularly after the adoption of flip chip technology, PBGA started to be widely used in supercomputers and workstations. The third generation of SMT is direct chip assembly (DCA), which is only used in specific fields due to limitations in reliability, cost, and KGD. In recent years, the third generation SMTs have been using wafer-level packaging (WLP) and advanced flip-chip technology to be compatible with semiconductor multi-pin and high-performance requirements. Thus, it can be concluded that IC packaging in the 21st century will develop towards the trend of high density, fine pitch, high flexibility, high reliability, and diversification. Therefore, it is essential to understand the difference between QFP and BGA and their development trends.

BGA assembly fits with medical PCB

When manufacturing medical electronic devices, it is crucial to choose the correct PCB assembly method. PCBA manufacturers must consider various factors such as reliability, safety, and quality control. In medical PCB assembly, BGA assembly is usually the preferred assembly method.

Medical devices require high reliability and stability, and BGA assembly can provide these requirements. BGA components are better equipped to disperse and handle heat, making them better suited to withstand high temperatures and humidity than traditional QFP components. Additionally, BGA PCB components can provide higher impedance control and signal integrity, which is vital in medical electronic equipment.

Another important factor is that medical devices often require smaller, lighter, and more compact designs, and BGA components can help achieve these goals. BGA components are smaller than QFP components and can take up less space, resulting in more miniaturized medical devices. Additionally, BGA components can improve manufacturing efficiency and reduce assembly costs because they can be assembled automatically by machines.

Of course, quality control and reliability are paramount in the medical PCB assembly process. This requires selecting an experienced PCBA manufacturer to ensure product quality and production efficiency. These manufacturers must adhere to industry standards and safety practices, and have top-notch quality control systems to ensure the reliability and safety of medical electronic devices.

In summary, BGA assembly inmedical PCB has many advantages, including high reliability, stability, smaller size, and higher manufacturing efficiency. However, selecting the right PCBA manufacturer is critical to ensuring quality and safety.