At Microsoft, Hardware Engineers drive the evolution of silicon solutions that underpin Azure's expansive cloud infrastructure and edge devices. Based in Redmond, WA, this role centers on architecting custom ASICs and SoCs to accelerate enterprise workloads, from AI inference to real-time data processing. Your contributions will shape hardware that enables seamless business scalability worldwide. Day-to-day involves spearheading RTL design for high-throughput processors, simulating power envelopes with Synopsys tools, and validating prototypes in thermal chambers. Collaborate with firmware teams to integrate ARM-based cores into hybrid cloud systems, troubleshoot signal integrity on 7nm nodes, and iterate designs based on field telemetry from Surface and Xbox ecosystems. Expect to lead small cross-functional pods on projects like low-latency networking chips, balancing cost, yield, and efficiency for volume production. Candidates need a BS or MS in Electrical Engineering or Computer Engineering, with 5+ years in ASIC design flows. Proficiency in Verilog/SystemVerilog, Cadence Virtuoso for analog blocks, and scripting in Python/Tcl is essential. Familiarity with PCIe Gen5 protocols and HBM memory interfaces sets top performers apart. Excel with FPGA emulation using Vivado, static timing analysis, and design partitioning for multi-die packages. Strong analytical mindset and collaborative spirit thrive here. Microsoft fosters innovation through agile pods and inclusive forums in our vibrant Redmond campus. Enjoy competitive compensation, comprehensive health coverage, generous PTO, and stock grants.